SPEAKERS
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PLENARY SPEAKERS
Komel Ehmann
Northwestern University, USA
Topic:
Fabrication of Functional Surfaces
Jiansheng Dai
Southern University of Science and Technology, China
Topic:
Embedded Intelligence in Mechanisms and Robotics for the Reconfigurable Manufacture System
Kenneth A. Dawson
University College Dublin, Ireland
Topic:
Bio-nanomanufacturing: Understanding of Biological Identity at the Nanoscale and Future Prospects
Enrico Savio
University of Padova, Italy
Topic:
Quality Control Benefits Identification and Quantification in Advanced Manufacturing
KEYNOTE SPEAKERS
Sung-Hoon Ahn
Seoul National University, Korea
Topic:
Shape Memory Alloy (SMA)-based Robotics and Actuators
Rong Chen
Huazhong University of Science and Technology, China
Topic:
Area Selective Deposition for Bottom-up Atomic Scale Manufacturing
Benny C.F. Cheung
Hong Kong Polytechnic University, Hong Kong
Topic:
Atomic and Close-to-Atomic Scale Analysis of Structural Evolution and Material Removal Mechanisms in Energy-Field Assisted Polishing
Xichun Luo
University of Strathclyde, UK
Topic:
Preliminary introduction to atomic and close-to atomic scale manufacturing
Michael Sealy
Purdue University, USA
Topic:
Nanomechanical evaluation of hybrid additively manufactured 420 stainless steel
Yuki Shimizhu
Hokkaido University, Japan
Topic:
Calibration of diffraction scale gratings with a high-precision angle measurement technology
Sandy Suet To
The Hong Kong Polytechnic University, Hong Kong SAR
Topic:
Molecular Dynamics Simulation of Tool Wear in Elliptical Vibration Cutting of 3C-SiC
Lihui Wang
KTH Royal Institute of Technology, Sweden
Topic:
How AI Technologies Impact on Smart Manufacturing
Kazuya Yamamura
Osaka University, Japan
Topic:
Plasma-assisted polishing for highly efficient and damage-free finishing of diamond substrates
Jiwang Yan
Keio University, Japan
Topic:
Cross-scale surface structuring technologies
Shuming Yang
Xi’an Jiaotong University, China
Topic:
Fabrication and Application of Nano Probers
Bi Zhang
Southern University of Science and Technology, China
Topic:
Grindability Improvement in High-Speed Grinding of Difficult-to-Machine Materials